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Amkor Technology Inc (AMKR)

NASDAQ
Currency in USD
Disclaimer
34.86
-0.22(-0.63%)
Closed
After Hours
34.860.00(0.00%)
AMKR Scorecard
Fair Value
Day's Range
33.9134.91
52 wk Range
17.5837.00
Prev. Close
35.08
Open
34.37
Day's Range
33.91-34.91
52 wk Range
17.58-37
Volume
929,225
Average Vol. (3m)
924,657
1-Year Change
32.05%
Shares Outstanding
246,170,251
Fair Value
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Dividends Payment Streak
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Analysts
Technical
Strong Sell
Sell
Neutral
Buy
Strong Buy
Strong Sell

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Amkor Technology Inc Company Profile

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.

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