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Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductor; invests in, develops, manufactures, and sells electronic components; and manufactures and sale of elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
Name | Age | Since | Title |
---|---|---|---|
Fei-Jain Wu | - | 1997 | Chairman and Research & Development Officer |
Huo-Wen Gao | - | 2006 | President & Director |
Jong-Fa Lee | - | 1997 | Director |
Ting-Rong Huang | - | 2012 | Independent Director |
H. H. Wei | - | 2020 | Independent Director |
Dang-Hsing Yiu | 70 | 2020 | Independent Director |
Wen-Feng Cheng | 71 | 2019 | Independent Director |
Oliver Chang | - | 2022 | Director |
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