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Xintec Inc. operates as a three-dimensional (3D) wafer level chip scale packaging company in Taiwan, the United States, Europe, and internationally. The company offers optical sensor chip-scale package technology for cellular phones, notebooks, gesture sensors, and laser intensity sensor for blue-ray and pico projectors; PPI and 3D Package technologies for use in integrated passive devices, power management IC and analogue IC, cellular phone RF IC, and capacitive couplers; and Micro-Electro-Mechanical Systems (MEMS) and sensor packaging for ink printer heads, motion sensors, temperature and humidity sensors, pressure sensors, identification sensors, pico-projector heads, silicon microphones, and bio sensors. It also provides design and modeling services for its technologies. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan, Taiwan.
Name | Age | Since | Title |
---|---|---|---|
Chia Hsiang Chen | - | 2017 | Chairman, GM & President |
Stella Wen | - | 2016 | Independent Director |
Y. J. Wang | - | 2018 | Representative Director |
Wen-Yeu Wang | - | 2013 | Independent Director |
Robert Hsieh | - | 2013 | Independent Director |
Mike Liang | - | 2023 | Independent Director |
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