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STATS ChipPAC Pte. Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for computing, communication, and consumer markets. It offers full service packaging design; electric, thermal, mechanical, and mold flow analysis; wafer bumping; turnkey semiconductor packaging and testing services; and document library. The company also offers research and development, warehousing services and drop shipment services, and pre-production and post-production services. STATS ChipPAC Pte. Ltd. markets its services through direct sales force in the United States, South Korea, China, Singapore, and Switzerland. The company was founded in 1994 and is headquartered in Singapore. STATS ChipPAC Pte. Ltd. is a subsidiary of JCET-SC (Singapore) Pte. Ltd.
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