BE Semiconductor Industries NV (BESI)

59.44
-2.62(-4.22%)
  • Volume:
    555,861
  • Bid/Ask:
    0.00/0.00
  • Day's Range:
    59.32 - 62.10

BESI Overview

Prev. Close
62.06
Day's Range
59.32 - 62.1
Revenue
485.48M
Open
62.06
52 wk Range
31.86 - 78.72
EPS
1.95
Volume
555,861
Market Cap
4.39B
Dividend (Yield)
1.70 (2.76%)
Average Vol. (3m)
577,490
P/E Ratio
31.91
Beta
1.46
1-Year Change
79.21%
Shares Outstanding
73,367,842
Next Earnings Date
Jul 27, 2021
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BE Semiconductor Industries NV News

  • BE Semiconductor Earnings, Revenue Miss in Q1
    • ByInvesting.com-

    Investing.com - BE Semiconductor reported on Friday first quarter earnings that missed analysts' forecasts and revenue that fell short of expectations. BE Semiconductor announced...

  • BE Semiconductor reports Q1 results; outlook
    • BySeeking Alpha-

    BE Semiconductor (BESIY): Q1 GAAP EPS of $0.47.Revenue of $143.2M (+56.8% Y/Y)Q2 2021 guidance: Revenue will increase by ~ 30-40% versus the € 143.2M reported in Q1-21; Gross...

  • BE Semiconductor Earnings, Revenue Beat in Q4
    • ByInvesting.com-

    Investing.com - BE Semiconductor reported on Friday fourth quarter earnings that beat analysts' forecasts and revenue that topped expectations. BE Semiconductor announced...

Technical Summary

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BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries NV Company Profile

Employees
1538

BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

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  • Great share and is valued by several stock advisor's between 72 and 75 euro. Still an upside of around 15% plus. Strong performance and a financially stable company. Doing well in the computer chips branch. Best of class in The Netherlands.
    0
    • Sell . There is bad news coming next week
      4
      • Can you be more specific?
        1
      • tardre
        0
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