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Supian Alias
Dec 11, 2021 7:50PM ET
intel will come back...
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Intel shows research for packing more computing power into chips beyond 2025
© Reuters. FILE PHOTO: The Intel logo is displayed on computer screens at SIGGRAPH 2017 in Los Angeles, California, U.S. July 31, 2017. REUTERS/Mike Blake/File Photo
By Stephen Nellis
(Reuters) - Research teams at Intel Corp (NASDAQ:INTC) on Saturday unveiled work that the company believes will help it keep speeding up and shrinking computing chips over the next ten years, with several technologies aimed at stacking parts of chips on top of each other.
Intel's Research Components Group introduced the work in papers at an international conference being held in San Francisco. The Silicon Valley company is working to regain a lead in making the smallest, fastest chips that it has lost in recent years to rivals like Taiwan Semiconductor Manufacturing Co and Samsung Electronics (OTC:SSNLF) Co Ltd.
While Intel CEO Pat Gelsinger has laid out commercial plans aimed at regaining that lead by 2025, the research work unveiled Saturday gives a look into how Intel plans to compete beyond 2025.
One of the ways Intel is packing more computing power into chips by stacking up "tiles" or "chiplets" in three dimensions rather than making chips all as one two-dimension piece. Intel showed work Saturday that could allow for 10 times as many connections between stacked tiles, meaning that more complex tiles can be stacked on top of one another.
But perhaps the biggest advance showed Saturday was a research paper demonstrating a way to stack transistors - tiny switches that form the most basic building bocks of chips by representing the 1s and 0s of digital logic - on top of one another.
Intel believes the technology will yield a 30% to 50% increase in the number of transistors it can pack into a given area on a chip. Raising the number of transistors is the main reason chips have consistently gotten faster over the past 50 years.
"By stacking the devices directly on top of each other, we're clearly saving area," Paul Fischer, director and senior principal engineer of Intel's Components Research Group told Reuters in an interview. "We're reducing interconnect lengths and really saving energy, making this not only more cost efficient, but also better performing."
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Comments (3)
Jason Patcher
Dec 11, 2021 5:57PM ET
they don't have the slave labor china does. remove china from world trade organization and everyone wins
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Insight
Dec 11, 2021 5:32PM ET
Bisssh please. Talk is cheap. Just look at FOVEROS. It's MILES away from TSMCs packaging technology. All that blabbering what they are about to do, just gets annoying when they clearly lagged behind for many years basically everywhere. Promises after promises. Reputation concerning that matter is basically ZERO. NADDA.NIENTE. NULL.
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Kaveh Sun
Dec 11, 2021 5:32PM ET
Different technologies. Tsmc is stacking chips, ie cpu, memory sensors etc into 1 package. Intel is trying making the chip in 3d, not packaging.
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